ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,032, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Bilayer memory stacking with lines shared between bottom and to... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,033, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Quasi-monolithic integrated packaging architecture with mid-die... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,034, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic structure including active base substrate with ... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,035, issued on April 7, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device" was invented by Jin Taek Park (... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,036, issued on April 7, was assigned to Arm Ltd. (Cambridge, Great Britain). "Circuit architecture in multi-dimensional monolithic structur... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,037, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Song-... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,038, issued on April 7, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device with a heat dissipation substrat... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,039, issued on April 7, was assigned to SHENZHEN JUFEI OPTOELECTRONICS Co. LTD (Shenzhen, China). "LED chip module and method for manufactu... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,040, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Three-dimensional integrated circuit structu... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,041, issued on April 7, was assigned to Innolux Corp. (Miaoli County, Taiwan). "Communication device and manufacturing method thereof" was ... Read More